Siltectra GmbH, founded in 2010 and headquartered in Dresden in Germany, is an innovative company specialising in the development of wafering technologies and related process equipment for the splitting of semiconductor materials.
With a patent portfolio of more than 50 patent families, Siltectra has developed a process that allows crystalline materials to be separated with minimal material loss compared to conventional sawing technology (COLD SPLIT technology). Infineon will use cold split technology to split silicon carbide wafers, doubling the number of chips in a wafer.
MIG Verwaltungs AG (MIG AG) is one of Germany’s leading venture capital investors, with over €1 billion in capital under management. The MIG Fonds are funds managed by MIG AG that provide financial support to start-ups in the areas of high tech and life sciences, from seed to expansion stage. Currently MIG AG manages a portfolio of 24 companies.