Reed Smith Client Alerts

Over the past month, the Bureau of Industry and Security (BIS) has implemented new, unilateral export controls to restrict China’s ability to manufacture advanced semiconductors, obtain high-performance chips, and develop and maintain supercomputers.

The rule, published on October 7, 2022, imposes new controls aimed at addressing U.S. national security and foreign policy concerns, including:

  • Adding certain advanced and high-performance computing chips and computer commodities that contain those chips, as well as certain semiconductor manufacturing equipment and related items, to the Commerce Control List (CCL);
  • Implementing new license requirements for items destined for a supercomputer or semiconductor development or production end use or the development or production of semiconductor manufacturing equipment, as well as for items destined for certain semiconductor fabrication facilities in China;
  • Expanding the scope of the Export Administration Regulations (EAR) over certain foreign-produced advanced computing items and foreign-produced items for supercomputer end uses;
  • Implementing expanded license requirements applicable to foreign-produced items for 28 existing entities on the Entity List located in China; and
  • Establishing a Temporary General License allowing specific, limited manufacturing activities related to items destined for use outside China.

As part of the new controls, BIS expanded its jurisdiction by informing U.S. persons that the following activities now require a license, even if the item is not subject to the EAR:

  • Shipping, transmitting, or transferring (in-country) to or within China any item the U.S. person knows will be used in the “development” or “production” of integrated circuits at semiconductor manufacturing “facilities” in China that make certain high-performance chips;
  • Shipping, transmitting, or transferring (in-country) to or within China any item meeting the parameters of any Export Control Classification Number (ECCN) in Product Groups B, C, D, or E in Category 3 of the CCL that the U.S. person knows will be used in the “development” or “production” of integrated circuits at semiconductor manufacturing “facilities” in China, regardless of the type of chips the facilities manufacture;
  • Shipping, transmitting, or transferring (in-country) to or within China any item meeting the parameters of ECCN 3B090, 3D001 (for 3B090), or 3E001 (for 3B090), regardless of the end use or end user;
  • Facilitating any of the actions above;